Also called Twin Lake, the processors have up to eight ‘Efficiency’ cores and aimed at applications dissipating 6 to 15W.

SOM-SMARC-TWL with have the SMARC (smart mobility architecture) form factor and provides connectivity options such as 2x NBase-T (2.5GbE supported), 2x USB 3.2 Gen 2, 6x USB 2.0 and 4x PCI-e Gen 3 lanes with optional SERDES.

Memory configuration includes quad channel soldered LPDDR5 with IBECC (in-band error correcting code). Operation is over -40°C to +85°C.

Aimed at the same temperature range, SOM-COMe-CT6-TWL is a similar processor board but in the COM Express Type 6 Compact form factor.

At the same time, computer-on-modules (CoMs) based on Intell Arrow Lake Series 2 Core Ultra Processors will be shown.

“These processors combine Lion Cove performance cores and Skymont efficiency cores [and] support DDR5 memory and PCIe 5.0,” said Seco. “Integrated Thunderbolt 4 and USB 4 provide connectivity, while a built-in neural processing unit reaches 13Top/s.”

The CoMs are the COM Express SOM-COMe-BT6-ARL and COM-HPC SOM-COM-HPC-A-ARL.

The COM Express version has 1x NBase-T 2.5 Gbit Ethernet, 4x USB 10 Gbps, 8x Hi-Speed USB, and up to 20x PCI-e Gen4 lanes. Two SO-DIMM slots support up to 64Gbyte of DDR5-5600 with IBECC.

In the COM-HPC variant are PCIe Gen 4/5, USB 4, 2x 2.5Gbit Ethernet, 4x USB 4.0/3.2, 4x USB 2.0, PCIe Gen 3 8×1 and PCIe Gen4 1×8 or 2×4. Optionally, a Wi-Fi 6E and Bluetooth 5.3 radio is available. Memory is two SO-DIMM slots for DDR5.

See them at Seco’s Embedded World stand: 320 in hall 1.