Molex, a global leader in electronics and connectivity innovation, has released a report that delves into the growing significance of ruggedised, miniaturised interconnect solutions. The report, entitled “Breaking Boundaries: Uniting Ruggedisation and Miniaturisation in Connector Design,” explores the trends, trade-offs, and enabling technologies that are paving the way for the future of electronics. You can read the original report here.
“Increasing demand for electronics in new vehicle platforms has intensified the need for smaller and rugged interconnects designed to withstand the harshest environments,” said Carrieanne Piccard, VP and GM of Transportation Innovative Solutions at Molex. “As a result, the ruggedisation of miniaturised connectors has become a key design principle, requiring a comprehensive approach throughout the component lifecycle to achieve optimal product reliability, performance, and longevity.”
Critical Connectivity Enablers
Molex defines miniature connectors as those with a pitch of 2.54mm or less, while ruggedness refers to their ability to withstand harsh environments and mechanical stresses. The convergence of ruggedisation and miniaturisation in interconnects has driven major innovations, particularly in the automotive industry, supporting electric vehicles (EVs) and zonal architectures. This trend is now spreading to other sectors, including consumer electronics (e.g., fitness trackers, smartwatches, and smart home devices), industrial automation (e.g., industrial robots, touchscreens, and sensors), and medical devices (e.g., endoscopes, insulin pumps, and wearable health monitors).
The adoption of compact, durable connectors is also gaining traction in smart agriculture. Vertical farming systems, with dense sensor and lighting installations, require space-efficient connectors that function reliably in wet, humid environments. Similarly, agricultural drones or “flying tractors” need connectors that can withstand extreme temperatures, vibrations, moisture, dust, and corrosive chemicals.
Pushing Design Boundaries
Molex’s report outlines best practices for overcoming major design and manufacturing obstacles to create smaller, lighter, and more reliable connectors. High-strength materials such as aluminium alloys, specialised steels, and high-performance polymers offer exceptional durability and lightweight construction. Processing these materials into complex connector geometries often requires advanced techniques, such as micro-moulding, high-precision machining, laser welding, or selective plating.
Dense pitch layouts enable higher contact density to accommodate smaller device footprints but necessitate high-precision manufacturing and assembly. To mitigate issues such as crosstalk and ineffective heat dissipation, engineers can employ advanced signal routing, shielding, and thermal management strategies like heat sinks or thermal vias. Molex DuraClik Connectors, for example, use high-temperature PBT material housings and secure terminal retention to endure extreme automotive conditions.
Advanced Connector Technologies
Multi-Functional Terminals (MFTs) represent a significant advancement in miniaturised connector technology by integrating multiple functionalities—power, signal, and mechanical features—into a single compact connector. Molex’s report also examines environmental factors that can compromise component reliability and offers strategies to ensure optimal performance in harsh conditions. Features like strain relief and robust contact design help maintain performance despite vibration, shock, and repeated mating cycles.
At Molex’s Global Reliability Lab, engineers simulate real-world conditions such as vibration, temperature cycling, and exposure to harsh chemicals. Molex Micro-Lock Plus Connectors address vibration challenges with a positive locking mechanism to ensure secure mating while preventing accidental disconnection in high-vibration environments. The connector’s metal solder tabs provide added strain relief to solder joints, enhancing resistance to mechanical stress and vibration.
Ingress protection is critical, as even a single drop of water or speck of dust can cause corrosion, shorts, and device failure. Molex’s Squba Connectors feature IP68-rated seals that can withstand nearly five feet of water for 30 minutes. These compact connectors optimise power delivery in one of the smallest, most durable form factors available.
As devices continue to shrink in size while expanding in functionality, Molex engineers are pushing the boundaries of miniaturisation and ruggedisation to solve real-world business challenges and exceed customer expectations.
About Molex
Molex is a global electronics leader committed to making the world a better, more connected place. With a presence in more than 40 countries, Molex enables transformative technology innovation across the automotive, data centre, industrial automation, healthcare, 5G, cloud, and consumer device industries. Through trusted customer and industry relationships, unrivalled engineering expertise, and product quality and reliability, Molex realises the infinite potential of Creating Connections for Life.
For more information, visit www.molex.com.